Giampaolo Tardioli

Giampaolo Tardioli is the vice president of the Chipset and Components segment, part of the Communications Solutions Group, he is in charge of solutions serving the modem, RFIC, and front-end modules markets. Prior to his current position, Giampaolo Tardioli was senior planning manager of the Communication Measurement Solution and member of the Central Planning Management team. He joined Hewlett-Packard in 1998 and served in a variety of senior management roles in R&D, quality, operations and manufacturing both at the division and business unit levels. Dr. Giampaolo Tardioli holds an M.Sc, in Electrical Engineering from the Universita’ Politecnica delle Marche, Italy, and a Ph.D. in Computational Electromagnetics from the University of Victoria, Canada.